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Applicant-type filters select Grants.gov records only; they do not establish your eligibility. Every search word must appear in the title, notice number, summary or buyer. SBIR/STTR filters select DSIP records; TACFI and RNI select the reviewed public calls. Unknown closing dates remain visible; check the original notice for interim deadlines.

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DSIP / STTRDARPA · Open

Scalable Hard-mask materials with Improved Etch resistance and Low Degradation for Extreme-aspect-Ratio fabrication (SHIELDER)

DPA26TZ06-DV004

Source closing date: 2026-10-21. Source timestamp: 2026-10-21T16:00:00+00:00.

DSIP calendar date uses America/New_York. Check the topic page for separate question windows and amendments.

DoW STTR 2026 BAA Nanofabrication, dry etching, hard mask, etching selectivity, high-aspect-ratio, pattern transfer. Develop and demonstrate novel nanofabrication hard-mask materials that exhibit substantially improved plasma etch resistance, enabling the implementation of extreme high-aspect-ratio structures with excellent pattern-transfer fidelity, minimal sidewall roughness, and precise dimensional control. Proposed solutions should overcome the fundamental limitations of conventional lithography masks in a scalable fabrication environment by creating next-generation technologies capable of delivering high-resolution nanoscale features en…

Eligibility information: Not assessed — read the full SBIR/STTR solicitation.

Observed 2026-10-13T01:36:01.052262+00:00.

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