US 12555902 B2 / Feb 17, 2026

Antenna apparatus employing radiation shield for integrated circuits

An antenna apparatus includes a radiation shield between an antenna element and at least one radio frequency integrated circuit (RFIC) coupled to the antenna element. An antenna substrate includes a first dielectric layer having opposite first and second surfaces, and a first metallization layer attached to the second surface to form a ground plane. A base substrate includes at least one second dielectric layer having opposite third and fourth surfaces, and a second metallization layer having a first side attached to the third surface and a second side attached to the first metallization layer to form the radiation shield. The RFIC is RF coupled to the antenna element through at least one via extending through the base substrate and a coupling element within aligned openings of the first and second metallization layers.

Publication details

Recorded assignee
VIASAT, INC.
Publication number
US 12555902 B2
Publication type
Utility patent grant
Publication date
Feb 17, 2026
Filing date
Dec 22, 2021
CPC classes
H01Q1/526, H01Q1/2283, H01Q1/48, H01Q5/335, H01Q9/0421, H01Q9/045, H01Q9/065
Inventors
Franson; Steven J.

Party names reflect the published document. Current ownership and legal status can change.

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