US 12749823 B2 / Sep 29, 2026

Method of forming antenna with underfill

A method of forming an antenna involves forming an antenna element on an upper surface of an antenna substrate; and forming an opening that extends from the upper surface to a lower surface of the antenna substrate. An RFIC component is attached to the lower surface of the antenna substrate through a plurality of interconnects, the RFIC component thereby being spaced from the lower surface of the antenna substrate. The RFIC component includes beamforming circuitry for RF coupling to the antenna element through the antenna substrate. Underfill is inserted into the opening from the upper surface such that the underfill flows within a space between the interconnects.

Publication details

Recorded assignee
VIASAT, INC.
Publication number
US 12749823 B2
Publication type
Utility patent grant
Publication date
Sep 29, 2026
Filing date
Apr 14, 2022
CPC classes
H01Q21/0087, H01Q21/065
Inventors
Franson; Steven J., Zaccardi; James B.

Party names reflect the published document. Current ownership and legal status can change.

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